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International Journal of Current Microbiology and Applied Sciences (IJCMAS)
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Original Research Articles                      Volume : 6, Issue:12, December, 2017

PRINT ISSN : 2319-7692
Online ISSN : 2319-7706
Issues : 12 per year
Publisher : Excellent Publishers
Email : editorijcmas@gmail.com /
submit@ijcmas.com
Editor-in-chief: Dr.M.Prakash
Index Copernicus ICV 2018: 95.39
NAAS RATING 2020: 5.38

Int.J.Curr.Microbiol.App.Sci.2017.6(12): 2738-2744
DOI: https://doi.org/10.20546/ijcmas.2017.612.317


Effect of Heat Stress on Yield Attributing Traits in Wheat (Triticum aestivum L.)
Ajit Tiwari, Shambhoo Prasad*, Bandana Jaiswal, Kunvar Gyanendra, Sonam Singh, and K.N. Singh
Department of Plant Molecular Biology and Genetic Engineering, Narendra Deva University of Agriculture and Technology, Kumarganj, Faizabad-224229, (U.P.), India
*Corresponding author
Abstract:

An experiment was conducted with four wheat varieties i.e. Halna, HD2733, Raj3765 and K9006 to evaluate heat stress traits in wheat and consequently development of high yielding heat tolerant wheat varieties. Heat stress treatment was given by delayed sowing under field condition. Parameter related to growth and yield attributing traits were observed under control and heat stress regimes. Wheat varieties Halna and Raj3765 showed less reduction in plant height, tiller numbers, chlorophyll content (SPAD value), membrane stability index, grains/spike, test weight and grain yield under heat regimes comparatively HD2733 and K9006. Though HD2733 and K9006 showed high yield under control condition but its yield significantly reduced under heat stress at reproductive stage.


Keywords: Heat stress, MSI, SPAD value, Yield attributing traits, Wheat.

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How to cite this article:

Ajit Tiwari, Shambhoo Prasad, Bandana Jaiswal, Kunvar Gyanendra, Sonam Singh and Singh, K.N. 2017. Effect of Heat Stress on Yield Attributing Traits in Wheat (Triticum aestivum L.).Int.J.Curr.Microbiol.App.Sci. 6(12): 2738-2744. doi: https://doi.org/10.20546/ijcmas.2017.612.317
Copyright: This is an Open Access article distributed under the terms of the Creative Commons Attribution-NonCommercial-ShareAlike license.

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